A Geometrically Self Compensated MEMS Capacitive Pressure Sensor with High Thermal Stability

Authors

  • Mojtaba Malekee * Department of Mechanical Engineering, Faculty of Mechanical Engineering, University of Guilan, Rasht, Guilan, Iran.
  • Mohammadreza Kazempoor Department of Mechanical Engineering, Islamic Azad University, Siahkal Center, Siahkal, Guilan, Iran.

https://doi.org/10.48313/mtei.v1i2.53

Abstract

This paper proposes a highly sensitive capacitive pressure sensor for which a new thermal-compensation method has been developed. The new method uses a geometric approach to compensate for the decrease in Young's modulus with temperature. The method is based on connecting a mass spring with a larger spring that is connected to the anchor. Because of the difference in thermal expansion of the large spring and the small spring, the smaller spring would experience axial tensile forces, leading to an increase in its stiffness. Thus, the increase in stiffness of the smaller spring could compensate for the decrease in the spring constant of the larger spring because of the thermal dependence of the Young's modulus. The pressure error due to temperature changes in the compensated sensor is less than 33 Pa, demonstrating a remarkable improvement compared with previous literature reports. The sensor's occupied area is about 0.03288 mm², and its sensitivity is 290 ppm. Compared with state-of-the-art Micro-Electro-Mechanical Systems (MEMS) capacitive pressure sensors reported in the literature between 2015 and 2024, the Temperature Coefficient of Sensitivity (TCS) obtained with the proposed design achieves an extremely low value of 28.52 ppm/°C. 

Keywords:

Capacitive pressure sensor, Micro-electro-mechanical systems, Thermal compensation, Temperature dependence, Young's modulus, Geometrical compensation

References

  1. [1] Damghanian, M., & Majlis, B. Y. (2009). Analysis and design of a wide micro beam as a pressure gauge for high sensitivity MEMS fingerprint sensors. Microsystem technologies, 15(5), 731–737. https://doi.org/10.1007/s00542-008-0755-4

  2. [2] Cong, P., Chaimanonart, N., Ko, W. H., & Young, D. J. (2009). A wireless and batteryless 10-bit implantable blood pressure sensing microsystem with adaptive RF powering for real-time laboratory mice monitoring. IEEE journal of solid-state circuits, 44(12), 3631–3644. https://doi.org/10.1109/JSSC.2009.2035551

  3. [3] Clausen, I., & Sveen, O. (2007). Die separation and packaging of a surface micromachined piezoresistive pressure sensor. Sensors and actuators a: Physical, 133(2), 457–466. https://doi.org/10.1016/j.sna.2006.05.011

  4. [4] Chang, S. P., & Allen, M. G. (2004). Demonstration for integrating capacitive pressure sensors with read-out circuitry on stainless steel substrate. Sensors and actuators a: Physical, 116(2), 195–204. https://doi.org/10.1016/j.sna.2004.04.010

  5. [5] Zhang, Y., Howver, R., Gogoi, B., & Yazdi, N. (2011). A high-sensitive ultra-thin MEMS capacitive pressure sensor. 2011 16th international solid-state sensors, actuators and microsystems conference (pp. 112–115). IEEE. https://doi.org/10.1109/TRANSDUCERS.2011.5969151

  6. [6] Ghanam, M., Bilger, T., Goldschmidtboeing, F., & Woias, P. (2022). MEMS self-packaged capacitive absolute pressure and force sensors for high-temperature applicatio. 2022 IEEE sensors (pp. 1–4). IEEE. https://doi.org/10.1109/SENSORS52175.2022.9967300

  7. [7] Ghanam, M., Goldschmidtboeing, F., Bilger, T., Bucherer, A., & Woias, P. (2023). MEMS shielded capacitive pressure and force sensors with excellent thermal stability and high operating temperature. Sensors, 23(9), 4248. https://doi.org/10.3390/s23094248

  8. [8] Kumar, G. A. A. U., Jindal, S. K., & P K, S. (2022). Capacitance response of concave well substrate MEMS double touch mode capacitive pressure sensor: Robust design, theoretical modeling, numerical simulation and performance comparison. Silicon, 14(15), 9659–9667. https://doi.org/10.1007/s12633-022-01693-9

  9. [9] Jindal, S. K., Patel, I., Sethi, K., Kaul, S., Sreekanth, P. K., & Kumar, A. (2022). Efficient in-depth analysis and optimum design parameter estimation of MEMS capacitive pressure sensor utilizing analytical approach for square diaphragm. Journal of computational electronics, 21(4), 992–1004. https://doi.org/10.1007/s10825-022-01896-8

  10. [10] Suman, S., Punetha, D., & Pandey, S. K. (2021). Improvement in sensing characteristics of silicon microstructure based MEMS capacitive sensor for automotive applications. Silicon, 13(5), 1475–1483. https://doi.org/10.1007/s12633-020-00540-z

  11. [11] Kehileche, B., Khoudrane, Y., Belmessaoud, B., Henini, N., & Chiba, Y. (2022). Performance analysis and enhancement of mems pressure sensor’s sensitivity based on new materials. Artificial intelligence and heuristics for smart energy efficiency in smart cities (pp. 779–785). Cham: Springer International Publishing. https://doi.org/10.1007/978-3-030-92038-8_79

  12. [12] Mohd Noor, A., Zakaria, Z., & Saad, N. (2021). Intraocular mems capacitive pressure sensor. Intelligent manufacturing and mechatronics (pp. 493–501). Singapore: Springer Singapore. https://doi.org/10.1007/978-981-16-0866-7_42

  13. [13] Licciardo, G. D., Vitolo, P., Bosco, S., Pennino, S., Pau, D., Pesaturo, M., … & Liguori, R. (2023). Ultra-tiny neural network for compensation of post-soldering thermal drift in mems pressure sensors. 2023 IEEE international symposium on circuits and systems (ISCAS) (pp. 1–5). IEEE. https://doi.org/10.1109/ISCAS46773.2023.10181480

  14. [14] Vitolo, P., Licciardo, G. D., Liguori, R., Di Benedetto, L., Rubino, A., Pau, D., & Pesaturo, M. (2024). In-sensor system for real-time compensation of thermal drift in mems pressure sensors. Proceedings of sie 2023 (pp. 186–191). Cham: Springer Nature Switzerland. https://doi.org/10.1007/978-3-031-48711-8_21

  15. [15] Thiem, C. D., & Hertline, J. M. (2009). Simulation concept-how to exploit tools for computing hybrids. https://apps.dtic.mil/sti/html/tr/ADA503259/

  16. [16] Mastrangelo, C. H., Zhang, X., & Tang, W. C. (1996). Surface-micromachined capacitive differential pressure sensor with lithographically defined silicon diaphragm. Journal of microelectromechanical systems, 5(2), 98–105. https://doi.org/10.1109/84.506197

  17. [17] Ganji, B. A., & Shahiri-Tabarestani, M. (2013). A novel high sensitive MEMS intraocular capacitive pressure sensor. Microsystem technologies, 19(2), 187–194. https://doi.org/10.1007/s00542-012-1688-5

  18. [18] Hao, X. C., Jiang, Y. G., Takao, H., Maenaka, K., Fujita, T., & Higuchi, K. (2011). Zero temperature coefficient gas-sealed pressure sensor using mechanical temperature compensation. 2011 16th international solid-state sensors, actuators and microsystems conference (pp. 116–119). IEEE. https://doi.org/10.1109/TRANSDUCERS.2011.5969152

  19. [19] Eswaran, P., & Malarvizhi, S. (2012). Sensitivity analysis on mems capacitive differential pressure sensor with bossed diaphragm membrane. 2012 international conference on devices, circuits and systems (ICDCS) (pp. 704–707). IEEE. https://doi.org/10.1109/ICDCSyst.2012.6188688

  20. [20] He, F., Huang, Q. A., & Qin, M. (2007). A silicon directly bonded capacitive absolute pressure sensor. Sensors and actuators a: Physical, 135(2), 507–514. https://doi.org/10.1016/j.sna.2006.09.022

Published

2024-06-23

How to Cite

Malekee, M. ., & Kazempoor, M. . (2024). A Geometrically Self Compensated MEMS Capacitive Pressure Sensor with High Thermal Stability. Mechanical Technology and Engineering Insights, 1(2), 122-131. https://doi.org/10.48313/mtei.v1i2.53

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